| dc.contributor.advisor | Carl V. Thompson. | en_US |
| dc.contributor.author | Joo, Young-Chang | en_US |
| dc.date.accessioned | 2005-08-17T18:38:43Z | |
| dc.date.available | 2005-08-17T18:38:43Z | |
| dc.date.copyright | 1995 | en_US |
| dc.date.issued | 1995 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/11446 | |
| dc.description | Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995. | en_US |
| dc.description | Includes bibliographical references (leaves 206-216). | en_US |
| dc.description.statementofresponsibility | by Young-Chang Joo. | en_US |
| dc.format.extent | 216 leaves | en_US |
| dc.format.extent | 12636318 bytes | |
| dc.format.extent | 12636077 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | eng | en_US |
| dc.publisher | Massachusetts Institute of Technology | en_US |
| dc.rights | M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. | en_US |
| dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | |
| dc.subject | Materials Science and Engineering | en_US |
| dc.title | Electromigration failure and reliability of single-crystal and polycyrstalline aluminum interconnects for integrated circuits | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Materials Science and Engineering | |
| dc.identifier.oclc | 33328012 | en_US |
