Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
Name
29329792-MIT.pdf
Description
Full printable version
Size
13.66 MB
Format
Adobe PDF
Checksum (MD5)
1d596fef0c649a00603e54910ad7a954
Author(s)
Smith, Gregory J. (Gregory John)
Advisor(s)
Lionel C. Kimerling and Steven D. Eppinger.
Date Issued
1993
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
Includes bibliographical references (p. 207-209).
Subjects
Sloan School of Management
Electrical Engineering and Computer Science
MIT Department
Sloan School of Management
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
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