Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications

Author(s)
Smith, Gregory J. (Gregory John)
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Advisor
Lionel C. Kimerling and Steven D. Eppinger.
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Description
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
 
Includes bibliographical references (p. 207-209).
 
Date issued
1993
URI
http://hdl.handle.net/1721.1/12393
Department
Sloan School of Management; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Publisher
Massachusetts Institute of Technology
Keywords
Sloan School of Management, Electrical Engineering and Computer Science
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