A liquid-shear-stress sensor using wafer-bonding technology

Author(s)
Ng, Kay-Yip
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Advisor
Martin A. Schmidt.
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Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.
 
Includes bibliographical references (leaves 131-135).
 
Date issued
1990
URI
http://hdl.handle.net/1721.1/13434
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Publisher
Massachusetts Institute of Technology
Keywords
Electrical Engineering and Computer Science
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