Show simple item record

A liquid-shear-stress sensor using wafer-bonding technology

dc.contributor.advisorMartin A. Schmidt.en_US
dc.contributor.authorNg, Kay-Yipen_US
dc.date.accessioned2005-09-21T22:20:03Z
dc.date.available2005-09-21T22:20:03Z
dc.date.copyright1990en_US
dc.date.issued1990en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/13434
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.en_US
dc.descriptionIncludes bibliographical references (leaves 131-135).en_US
dc.description.statementofresponsibilityby Kay-Yip Ng.en_US
dc.format.extent135 leavesen_US
dc.format.extent8102906 bytes
dc.format.extent8102667 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleA liquid-shear-stress sensor using wafer-bonding technologyen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc25615925en_US


Files in this item

Thumbnail
Name:
25615925-MIT.pdf
Size:
7.727Mb
Format:
PDF
Description:
Full printable version
View/Open

This item appears in the following Collection(s)

Show simple item record