Thermal fatigue of solder joints in micro-electronic devices

Author(s)
Adams, Pamela Joan
Thumbnail
DownloadFull printable version (8.108Mb)
Other Contributors
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Advisor
Lallit Anand.
Terms of use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
Metadata
Show full item record
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986.
 
MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING
 
Bibliography: leaves 48-52.
 
Date issued
1986
URI
http://hdl.handle.net/1721.1/15070
Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Mechanical Engineering.
Collections