| dc.contributor.advisor | Lallit Anand. | en_US |
| dc.contributor.author | Adams, Pamela Joan | en_US |
| dc.contributor.other | Massachusetts Institute of Technology. Dept. of Mechanical Engineering. | en_US |
| dc.date.accessioned | 2005-08-08T17:12:54Z | |
| dc.date.available | 2005-08-08T17:12:54Z | |
| dc.date.copyright | 1986 | en_US |
| dc.date.issued | 1986 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/15070 | |
| dc.description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986. | en_US |
| dc.description | MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING | en_US |
| dc.description | Bibliography: leaves 48-52. | en_US |
| dc.description.statementofresponsibility | by Pamela Joan Adams. | en_US |
| dc.format.extent | 142 leaves | en_US |
| dc.format.extent | 8502861 bytes | |
| dc.format.extent | 8502620 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | eng | en_US |
| dc.publisher | Massachusetts Institute of Technology | en_US |
| dc.rights | M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. | en_US |
| dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | |
| dc.subject | Mechanical Engineering. | en_US |
| dc.title | Thermal fatigue of solder joints in micro-electronic devices | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | M.S. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Mechanical Engineering | |
| dc.identifier.oclc | 15625969 | en_US |
