Nanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
Author(s)
Arora, William Jay
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Alternative title
Folding thin films out of the plane of a silicon wafer with highly stressed chromium hinges
Other Contributors
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
Advisor
George Barbastathis and Henry I. Smith.
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This thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes.
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. Includes bibliographical references (p. 81-84).
Date issued
2005Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer SciencePublisher
Massachusetts Institute of Technology
Keywords
Electrical Engineering and Computer Science.