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dc.contributor.advisorGeorge Barbastathis and Henry I. Smith.en_US
dc.contributor.authorArora, William Jayen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2006-06-19T17:41:09Z
dc.date.available2006-06-19T17:41:09Z
dc.date.copyright2005en_US
dc.date.issued2005en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/33107
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.en_US
dc.descriptionIncludes bibliographical references (p. 81-84).en_US
dc.description.abstractThis thesis addresses the construction of complex three-dimensional (3-D) nanostructures using only 2-D, planar nano-fabrication techniques. In the state of the art, multiple 2-D layers are fabricated in series, each directly on top of the previous. The method advocated here is Nanostructured Origami, in which multiple adjacent 2-D layers are fabricated in parallel and are then folded into the desired 3-D configuration using the appropriate folding sequence. This thesis focuses on folding actuation for this method using the residual tensile stress in vacuum-evaporated chromium to fold silicon nitride membranes. Our results conclusively demonstrate the ability to pattern these membranes with nano-scale features and then controllably fold them into a predetermined 3-D configuration. Future work will refine the fabrication procedure for large-scale manufacturing and address alignment and latching of the folded membranes.en_US
dc.description.statementofresponsibilityby William Jay Arora.en_US
dc.format.extent84 p.en_US
dc.format.extent4876777 bytes
dc.format.extent4880756 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleNanostructured Origami (TM) : folding thin films out of the plane of a silicon wafer with highly stressed chromium hingesen_US
dc.title.alternativeFolding thin films out of the plane of a silicon wafer with highly stressed chromium hingesen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc62221878en_US


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