Search
Now showing items 1-2 of 2
Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization
(2002-01)
An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the ...
Length Effects on the Reliability of Dual-Damascene Cu Interconnects
(2002-01)
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...