Advanced Materials for Micro- and Nano-Systems (AMMNS): Recent submissions

Now showing items 91-93 of 122

    • Wafer-Level Thermocompression Bonds 

      Tsau, Christine H.; Schmidt, Martin A.; Spearing, S. Mark (2003-01)
      Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding without the application of an electric field or complicated pre-bond cleaning procedure. The presence of a ductile ...

    • TiNi shape memory alloy thin films for microactuator application 

      Fu, Yongqing; Du, Hejun (2003-01)
      TiNi films were prepared by co-sputtering TiNi target and a separate Ti target. Crystalline structure and phase transformation behaviors of TiNi films were investigated. Results showed that TiNi films had fine grain size ...

    • Simplified Model and Numerical Analysis of Multi-layered Piezoelectric Diaphragm 

      Yao, Lin-Quan; Lu, Li (2003-01)
      The validity of the dynamic analysis based on simplified plate model was investigated using of FE-codes ANSYS in the present paper. The simplified clamped multi-layered plate model was first verified by comparison with the ...