Face-up chemical mechanical polishing : kinematics and material removal rate
Author(s)Shieh, Marvin Bryan
Face-up CMP : kinematics and material removal rate
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Jung-Hoon Chun and Nannaji Saka.
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A working prototype face-up CMP tool has successfully been completed. Experiments conducted on the face-up CMP machine qualitatively correspond with the theoretical polishing model. Discrepancies in data from the theoretical model could potentially be caused by non-uniform loading of the polishing pad and uneven distribution of slurry over the pad due to the edge effects on fluid flow. Despite the discrepancies, experimental data suggest that the theoretical model used to describe blanket wafer polishing by the face-up CMP tool is at least partially valid.
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2006.Includes bibliographical references (leaf 27).
DepartmentMassachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology