Carbon nanotube interconnects for IC chips
Author(s)Anwar Ali, Hashina Parveen
CNT interconnects for Integrated Chip chips
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Carl V. Thompson.
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Carbon nanotubes (CNTs) have been investigated as candidate materials to replace or augment the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of copper in terms of their performance and integration into the current commercial IC chip process. A detailed literature review is covered, together with a performance analysis of the resistances between copper and CNT interconnects. Further, a business model is proposed on the possibility of introducing this technology into the mainstream IC industry.
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.Includes bibliographical references (leaves 93-94).
DepartmentMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Massachusetts Institute of Technology
Materials Science and Engineering.