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dc.contributor.advisorCarl V. Thompson.en_US
dc.contributor.authorAnwar Ali, Hashina Parveenen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2007-05-16T18:26:36Z
dc.date.available2007-05-16T18:26:36Z
dc.date.copyright2006en_US
dc.date.issued2006en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/37373
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.en_US
dc.descriptionIncludes bibliographical references (leaves 93-94).en_US
dc.description.abstractCarbon nanotubes (CNTs) have been investigated as candidate materials to replace or augment the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of copper in terms of their performance and integration into the current commercial IC chip process. A detailed literature review is covered, together with a performance analysis of the resistances between copper and CNT interconnects. Further, a business model is proposed on the possibility of introducing this technology into the mainstream IC industry.en_US
dc.description.statementofresponsibilityby Hashina Parveen Anwar Ali.en_US
dc.format.extent97 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineering.en_US
dc.titleCarbon nanotube interconnects for IC chipsen_US
dc.title.alternativeCNT interconnects for Integrated Chip chipsen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc104699663en_US


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