Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction

Author(s)
Slade, J. Morgan
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Advisor
David K. Roylance.
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Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.
 
Includes bibliographical references (leaves 123-125).
 
Date issued
1996
URI
http://hdl.handle.net/1721.1/40221
Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Materials Science and Engineering
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