Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction
Name
35953996-MIT.pdf
Description
Full printable version
Size
39.17 MB
Format
Adobe PDF
Checksum (MD5)
0035aaf3d759191c38f5220884fce251
Author(s)
Slade, J. Morgan
Advisor(s)
David K. Roylance.
Date Issued
1996
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.
Includes bibliographical references (leaves 123-125).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
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