| dc.contributor.advisor | David K. Roylance. | en_US |
| dc.contributor.author | Slade, J. Morgan | en_US |
| dc.date.accessioned | 2008-02-04T21:05:43Z | |
| dc.date.available | 2008-02-04T21:05:43Z | |
| dc.date.copyright | 1996 | en_US |
| dc.date.issued | 1996 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/40221 | |
| dc.description | Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996. | en_US |
| dc.description | Includes bibliographical references (leaves 123-125). | en_US |
| dc.description.statementofresponsibility | by J. Morgan Slade. | en_US |
| dc.format.extent | 125 leaves | en_US |
| dc.language.iso | eng | en_US |
| dc.publisher | Massachusetts Institute of Technology | en_US |
| dc.rights | M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. | en_US |
| dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | |
| dc.subject | Materials Science and Engineering | en_US |
| dc.title | Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | M.S. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Materials Science and Engineering | |
| dc.identifier.oclc | 35953996 | en_US |
