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dc.contributor.advisorJames Chung, Duane Boning.en_US
dc.contributor.authorChang, Eric Choong-Yinen_US
dc.date.accessioned2008-04-23T14:53:15Z
dc.date.available2008-04-23T14:53:15Z
dc.date.copyright1996en_US
dc.date.issued1996en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/41383
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.en_US
dc.descriptionIncludes bibliographical references (leaf 109).en_US
dc.description.statementofresponsibilityby Eric Choong-Yin Chang.en_US
dc.format.extent109 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleA statistical metrology framework for characterizing ILD thickness variation in CMP processesen_US
dc.title.alternativeStatistical metrology framework for characterizing inter-level dielectric thickness variation in chemical machine polishing.en_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc35334677en_US


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