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Computer Detection of Bent Fingers in Lead Bonding Frames

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dc.contributor.author Mitnick, Walter L.
dc.date.accessioned 2008-08-26T16:21:08Z
dc.date.available 2008-08-26T16:21:08Z
dc.date.issued 1976-01
dc.identifier.uri http://hdl.handle.net/1721.1/41997
dc.description This report describes research done at the Artificial Intelligence Laboratory of the Massachusetts Institute of Technology. Support for the laboratory's artificial intelligence research is provided in part by the Advanced Research Projects Agency of the Department of Defense under Office of Naval Research contract N00014-75-C-0643. en
dc.description.abstract In the production of logic circuits in dual inline packages, various tedious assembly line tasks are performed by human operators using microscopes or television enlargements. One boring and difficult task is the detection of bent fingers in lead bonding frames to which integrated circuit chips are subsequently bonded. Bent fingers can cause stresses which may eventually lead to the failure of circuits. This paper discusses the inspection problem and presents a computerized bent finger detection method which could be adapted to free human operators from this task. More immediately, it presents a method of examining an object and determining whether or not it is in focus based solely on inspection of the object's digitized light intensity profiles. en
dc.description.sponsorship MIT Artificial Intelligence Laboratory Department of Defense Advanced Research Projects Agency en
dc.language.iso en_US en
dc.publisher MIT Artificial Intelligence Laboratory en
dc.relation.ispartofseries MIT Artificial Intelligence Laboratory Working Papers, WP-117;
dc.title Computer Detection of Bent Fingers in Lead Bonding Frames en
dc.type Working Paper en


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