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dc.contributor.advisorCarl V. Thompson.en_US
dc.contributor.authorFayad, Walid R. (Walid Rahif)en_US
dc.date.accessioned2009-04-29T17:48:07Z
dc.date.available2009-04-29T17:48:07Z
dc.date.copyright1997en_US
dc.date.issued1997en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/45477
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering, 1997.en_US
dc.descriptionIncludes bibliographical references (leaves 85-87).en_US
dc.description.statementofresponsibilityby Walid R. Fayad.en_US
dc.format.extent87 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectCivil and Environmental Engineeringen_US
dc.titleSimulation of the effect of microstructure on electromigration induced failure of interconnectsen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Civil and Environmental Engineering
dc.identifier.oclc37519913en_US


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