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3.22 Mechanical Properties of Materials, Spring 2004

Author(s)
Gibson, Lorna J.
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Download3-22Spring-2004/OcwWeb/Materials-Science-and-Engineering/3-22Spring-2004/CourseHome/index.htm (15.51Kb)
Alternative title
Mechanical Properties of Materials
Terms of use
Usage Restrictions: This site (c) Massachusetts Institute of Technology 2003. Content within individual courses is (c) by the individual authors unless otherwise noted. The Massachusetts Institute of Technology is providing this Work (as defined below) under the terms of this Creative Commons public license ("CCPL" or "license"). The Work is protected by copyright and/or other applicable law. Any use of the work other than as authorized under this license is prohibited. By exercising any of the rights to the Work provided here, You (as defined below) accept and agree to be bound by the terms of this license. The Licensor, the Massachusetts Institute of Technology, grants You the rights contained here in consideration of Your acceptance of such terms and conditions.
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Abstract
Phenomenology of mechanical behavior of materials at the macroscopic level. Relationship of mechanical behavior to material structure and mechanisms of deformation and failure. Topics include: elasticity, viscoelasticity, plasticity, creep, fracture, and fatigue. Case studies and examples drawn from a variety of classes of materials including: metals, ceramics, polymers, thin films, composites, and cellular materials.
Date issued
2004-06
URI
http://hdl.handle.net/1721.1/46339
Other identifiers
3.22-Spring2004
local: 3.22
local: IMSCP-MD5-7661f0542f83764e9674d7235d3f9910
Keywords
metals, semiconductors, ceramics, polymers, bonding, structure, energy band, microstructure, composition, semiconductor diodes, optical detectors, sensors, thin films, biomaterials, cellular materials

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