Framework for characterization of copper interconnect in damascene CMP processes

Author(s)
Park, Tae Hong, 1973-
Thumbnail
DownloadFull printable version (39.06Mb)
Alternative title
Characterization and modeling of pattern dependent variation in copper damascene CMP processes
Advisor
Duane Boning and James Chung.
Terms of use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
Metadata
Show full item record
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.
 
Includes bibliographical references (leaves 73-75).
 
Date issued
1998
URI
http://hdl.handle.net/1721.1/50041
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Publisher
Massachusetts Institute of Technology
Keywords
Electrical Engineering and Computer Science
Collections