dc.contributor.advisor | Duane Boning and James Chung. | en_US |
dc.contributor.author | Park, Tae Hong, 1973- | en_US |
dc.date.accessioned | 2009-12-10T19:04:26Z | |
dc.date.available | 2009-12-10T19:04:26Z | |
dc.date.copyright | 1998 | en_US |
dc.date.issued | 1998 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/50041 | |
dc.description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998. | en_US |
dc.description | Includes bibliographical references (leaves 73-75). | en_US |
dc.description.statementofresponsibility | by Tae Hong Park. | en_US |
dc.format.extent | 75 leaves | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
dc.subject | Electrical Engineering and Computer Science | en_US |
dc.title | Framework for characterization of copper interconnect in damascene CMP processes | en_US |
dc.title.alternative | Characterization and modeling of pattern dependent variation in copper damascene CMP processes | en_US |
dc.type | Thesis | en_US |
dc.description.degree | B.S. | en_US |
dc.description.degree | M.Eng. | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
dc.identifier.oclc | 40458672 | en_US |