Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability
Author(s)
Clough, Sherry L. (Sherry Lynn), 1969-![Thumbnail](/bitstream/handle/1721.1/50398/40606893-MIT.pdf.jpg?sequence=5&isAllowed=y)
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Advisor
Roy Welsch and Frederic McGarry.
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Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998. Includes bibliographical references (p. 109-110).
Date issued
1998Department
Sloan School of Management; Massachusetts Institute of Technology. Department of Materials Science and EngineeringPublisher
Massachusetts Institute of Technology
Keywords
Sloan School of Management, Materials Science and Engineering