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dc.contributor.advisorMartin Culpepper.en_US
dc.contributor.authorUtz, Robert (Robert C.)en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2010-04-28T15:40:58Z
dc.date.available2010-04-28T15:40:58Z
dc.date.copyright2009en_US
dc.date.issued2009en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/54485
dc.descriptionThesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 52).en_US
dc.description.abstractThis thesis develops a thermodynamic simulation of the melting and solidification of a substance resting on a surface. The simulation was created in an effort to develop a single actuator joint locking and unlocking mechanism for Squishbot. The Squishbot is a proposed robot that has the ability to climb walls and change shape in order to gain entry into normally inaccessible areas. By using COMSOL Multiphysics, a simple model was developed and tested. Under these conditions, the solder melting phase transition took 2.25 seconds to melt and 2.65 seconds to solidify. These results, as well as observations about the behavior of the program's numerical solver, seem to suggest that the proposed joint locking system is feasible. A framework is laid out to proceed with improved and more specific models for use as an optimization tool.en_US
dc.description.statementofresponsibilityby Robert Utz.en_US
dc.format.extent52 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleThermodynamic modeling of solder melting and solidification for proposed squishbot designen_US
dc.typeThesisen_US
dc.description.degreeS.B.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc558536185en_US


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