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dc.contributor.advisorVladimir Bulović.en_US
dc.contributor.authorMurarka, Apoorvaen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2013-02-14T19:17:01Z
dc.date.available2013-02-14T19:17:01Z
dc.date.copyright2012en_US
dc.date.issued2012en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/77080
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 105-107).en_US
dc.description.abstractMicroelectromechanical systems (MEMS) are ubiquitous. Scalable large-area arrays of MEMS on a variety of substrates, including flexible substrates, have many potential applications. Novel methods for additive fabrication of thin (125±15 nm thick) suspended gold membranes on a variety of rigid and flexible cavity-patterned substrates for MEMS applications are reported. The deflection of these membranes, suspended over cavities in a dielectric layer atop a conducting electrode, can be used to produce sounds or monitor pressure. The reported fabrication methods employ contact-printing, and avoid fabrication of MEMS diaphragms via wet or deep reactive-ion etching, which in turn removes the need for etch-stops and wafer bonding. Elevated temperature processing is also avoided to enable MEMS fabrication on flexible polymeric substrates. Thin films up to 12.5 mm2 in area are fabricated. The MEMS devices are electrically actuated and the resulting membrane deflection is characterized using optical interferometry. Preliminary sound production is demonstrated, and further applications of this technology are discussed.en_US
dc.description.statementofresponsibilityby Apoorva Murarka.en_US
dc.format.extent107 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleContact-printed microelectromechanical systemsen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc825818232en_US


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