A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding

Author(s)
Yung, Chi-Fan, 1973-
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Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.
Advisor
Martin A. Schmidt.
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Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
 
Includes bibliographical references (p. 89-90).
 
Date issued
1999
URI
http://hdl.handle.net/1721.1/80148
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Publisher
Massachusetts Institute of Technology
Keywords
Electrical Engineering and Computer Science.
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