| dc.contributor.advisor | Martin A. Schmidt. | en_US |
| dc.contributor.author | Yung, Chi-Fan, 1973- | en_US |
| dc.contributor.other | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. | en_US |
| dc.date.accessioned | 2013-08-22T18:54:38Z | |
| dc.date.available | 2013-08-22T18:54:38Z | |
| dc.date.copyright | 1999 | en_US |
| dc.date.issued | 1999 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/80148 | |
| dc.description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. | en_US |
| dc.description | Includes bibliographical references (p. 89-90). | en_US |
| dc.description.statementofresponsibility | by Chi-Fan Yung. | en_US |
| dc.format.extent | 90 p. | en_US |
| dc.language.iso | eng | en_US |
| dc.publisher | Massachusetts Institute of Technology | en_US |
| dc.rights | M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission. | en_US |
| dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
| dc.subject | Electrical Engineering and Computer Science. | en_US |
| dc.title | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | S.M. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
| dc.identifier.oclc | 43626577 | en_US |
