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dc.contributor.advisorRafael Reif.en_US
dc.contributor.authorKim, Hyoun-wooen_US
dc.date.accessioned2005-09-26T18:37:04Z
dc.date.available2005-09-26T18:37:04Z
dc.date.copyright1994en_US
dc.date.issued1994en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/28125
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994.en_US
dc.descriptionIncludes bibliographical references (leaves 138-143).en_US
dc.description.statementofresponsibilityby Hyoun-woo Kim.en_US
dc.format.extent143 leavesen_US
dc.format.extent8771647 bytes
dc.format.extent8790822 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineeringen_US
dc.titleWafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposureen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Dept. of Materials Science and Engineeringen_US
dc.identifier.oclc32147490en_US


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