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6.152J / 3.155J Microelectronics Processing Technology, Fall 2003

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Title: 6.152J / 3.155J Microelectronics Processing Technology, Fall 2003
Author: Schmidt, Martin A.; O'Handley, Robert C., 1942-; Ruff, Susan
Issue Date: 2003-12
Abstract: Introduces the theory and technology of integrated-circuit fabrication. Lectures and laboratory sessions on basic processing techniques such as diffusion, oxidation, epitaxy, photolithography, chemical vapor deposition, and plasma etching. Emphasis on the interrelationships between material properties, device structure, and the electrical behavior of devices. Provides background for thesis work in microelectronics or for 6.151. From the course home page: Course Description This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.
URI: http://hdl.handle.net/1721.1/36872
Other Identifiers: 6.152J-Fall2003
Other Identifiers: 6.152J
3.155J
IMSCP-MD5-beaf56117a9c987185ba38d080bf124a
Keywords: microelectronics, Microelectronics processing, integrated circuits, vacuum, chemical vapor deposition, CVD, oxidation, diffusion, implantation, lithography, soft lithography, etching, sputtering, evaporation, interconnect, metallization, crystal growth, reliability, fabrication, processing, photolithography, physical vapor deposition, MOS, MOS capacitor, microcantilever, microfluidic, 6.152J, 3.155J, 6.152, 3.155, 140902, Computer Hardware Engineering

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