Tracking Wires on Printed Circuit Boards

dc.contributor.author	Finin, Tim
dc.date.accessioned	2008-04-08T19:18:49Z
dc.date.available	2008-04-08T19:18:49Z
dc.date.issued	1973-10
dc.identifier.uri	http://hdl.handle.net/1721.1/41085
dc.description	Work reported herein was conducted at the Artificial Intelligence Laboratory, a Massachusetts Institute of Technology research program supported in part by the Advanced Research Projects Agency of the Department of Defense and monitored by the Office of Naval Research under Contract Number N00014-70-A-0362-0005. Vision Flashes are informal papers intended for internal use.	en
dc.description.abstract	This working paper describes a collection of LISP programs written to examine the backs of printed circuit boards. These programs find and trace the conductive wires plated on the insulating material. The "pads", or solder connections between these plated wires and leads from components on the front of the board, are also recognized and located by these programs.	en
dc.description.sponsorship	MIT Artificial Intelligence Laboratory	en
dc.language.iso	en_US	en
dc.publisher	MIT Artificial Intelligence Laboratory	en
dc.relation.ispartofseries	MIT Artificial Intelligence Laboratory Working Papers, WP-52	en
dc.title	Tracking Wires on Printed Circuit Boards	en
dc.type	Working Paper	en