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Wettability of low Sn solders on integrated circuit package metallizations

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Wettability of low Sn solders on integrated circuit package metallizations

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Author: Gabriel, Michelle Wendy
Other Contributors: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Advisor: Nicholas J. Grant.
Department: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Publisher: Massachusetts Institute of Technology
Date Issued: 1983
Description:
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983.MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCEIncludes bibliographical references.
URI: http://hdl.handle.net/1721.1/42094
Keywords: Materials Science and Engineering.

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