Login

Effect of chemical mechanical planarization processing conditions on polyurethane pad properties

Show simple item record

dc.contributor.advisor David K. Roylance. en_US
dc.contributor.author Ng, Grace Siu-Yee, 1980- en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.date.accessioned 2009-07-01T18:47:11Z
dc.date.available 2009-07-01T18:47:11Z
dc.date.copyright 2003 en_US
dc.date.issued 2003 en_US
dc.identifier.uri http://dspace.mit.edu/handle/1721.1/43618 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/43618
dc.description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2003. en_US
dc.description Includes bibliographical references (leaves 58-59). en_US
dc.description.provenance Made available in DSpace on 2009-07-01T18:47:11Z (GMT). No. of bitstreams: 2 54818365.pdf: 16855378 bytes, checksum: 86208ea4addce98adef42331750c53d0 (MD5) 54818365-MIT.pdf: 16855184 bytes, checksum: 36ed22802b83c4fe576ef6ee2a478a0e (MD5) Previous issue date: 2003 en
dc.description.statementofresponsibility by Grace Siu-Yee Ng. en_US
dc.format.extent 59 leaves en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/43618 en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Materials Science and Engineering. en_US
dc.title Effect of chemical mechanical planarization processing conditions on polyurethane pad properties en_US
dc.type Thesis en_US
dc.description.degree S.M. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.identifier.oclc 54818365 en_US

Files in this item

Files Size Format
Preview, non-printable (open to all) 16.85Mb application/pdf
Full printable version (MIT only) 16.85Mb application/pdf

This item appears in the following Collection(s)

Show simple item record

Search DSpace@MIT


Advanced Search

Browse

My Account

Links