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Now showing items 11-20 of 554
Wafer-Level Thermocompression Bonds
(2003-01)
Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding without the application of an electric field or complicated pre-bond cleaning procedure. The presence of a ductile ...
Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments
(2004-01)
Electromigration experiments have been carried out on straight interconnects that have single vias at each end, and are divided into two segments by a via in the center ("dotted-I" structures). For dotted-i structures in ...
Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding
(2003-01)
Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ...
Novel CMOS-Compatible Optical Platform
(2003-01)
A research synopsis is presented summarizing work with integration of Ge and III-V semiconductors and optical devices with Si. III-V GaAs/AlGaAs quantum well lasers and GaAs/AlGaAs optical circuit structures have been ...
GaN Based Nanomaterials Fabrication with Anodic Aluminium Oxide by MOCVD
(2003-01)
A highly self-ordered hexagonal array of cylindrical pores has been fabricated by anodizing a thin film of Al on substrate and subsequent growth of GaN and InGaN in these nanoholes has been performed. This AAO template-based ...
Bubble Simulation Using Level Set-Boundary Element Method
(2003-01)
In bubble dynamics, an underwater bubble may evolve from being singly-connected to being toroidal. Furthermore, two or more individual bubbles may merge to form a single large bubble. These dynamics involve significant ...
Investigation on Thin Film Lithium Microbatteries
(2004-01)
Thin film lithium microbatteries were investigated in this project in which LiCoO₂ cathodes about 200 to 500 nm were fabricated by pulsed-laser deposition (PLD) at different processing parameters such as laser energy ...
Stabilization of Therapeutic Proteins
(2003-01)
We present results of molecular simulations, quantum mechanical calculations, and experimental data aimed towards the rational design of solvent formulations. In particular, we have found that the rate limitation of oxidation ...
Selective DNA-Directed Assembly on Dual-Functionalized Microparticles
(2004-01)
The bottom-up assembly of functional devices requires novel building blocks to facilitate the incorporation of functional and structural hierarchy. Anisotropic building blocks can substantially broaden the creation of ...
Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
(2002-01)
This paper presents a new technique for the monolithic heterogeneous integration of compound semiconductor devices with silicon integrated circuits, and establishes the theoretical foundation for a key element of the ...