Polytope Sector-Based Synthesis and Analysis of Microarchitectured Materials With Tunable Thermal Conductivity and Expansion
Author(s)
Spadaccini, Christopher M.; Hopkins, Jonathan B.; Fang, Xuanlai; Lee, Howon
Downloadv02bt03a006-detc2015-46645.pdf (4.949Mb)
PUBLISHER_POLICY
Publisher Policy
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Terms of use
Metadata
Show full item recordAbstract
The aim of this paper is to (1) introduce an approach, called Polytope Sector-based Synthesis, for synthesizing 2D or 3D microstructural architectures that exhibit a desired bulk-property directionality (e.g., isotropic, cubic, orthotropic, etc.), and (2) provide general analytical methods that can be used to rapidly optimize the geometric parameters of these architectures such that they achieve a desired combination of bulk thermal conductivity and thermal expansion properties. Although the methods introduced can be applied to general beam-based microstructural architectures, we demonstrate their utility in the context of an architecture that can be tuned to achieve a large range of extreme thermal expansion coefficients — positive, zero, and negative. The material-property-combination region that can be achieved by this architecture is determined within an Ashby-material-property plot of thermal expansion vs. thermal conductivity using the analytical methods introduced. Both 2D and 3D versions of the design have been fabricated using projection microstereolithography.
Date issued
2015-08Department
Massachusetts Institute of Technology. Department of Mechanical EngineeringJournal
Volume 2B: 41st Design Automation Conference
Publisher
ASME International
Citation
Hopkins, Jonathan B., Howon Lee, Nicholas X. Fang, and Christopher M. Spadaccini. “Polytope Sector-Based Synthesis and Analysis of Microarchitectured Materials With Tunable Thermal Conductivity and Expansion.” Volume 2B: 41st Design Automation Conference (August 2, 2015), Boston, Massachusetts, USA, 2015. © ASME International 2015
Version: Final published version
ISBN
978-0-7918-5708-3