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Soft robotic fingers with embedded ionogel sensors and discrete actuation modes for somatosensitive manipulation

Author(s)
Truby, Ryan; Katzschmann, Robert Kevin; Lewis, Jennifer A.; Rus, Daniela L
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Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/
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Abstract
Soft robotic grippers enable gentle, adaptive, and bioinspired manipulation that is simply not possible using traditional rigid robots. However, it has remained challenging to create multi-degree-of-freedom soft actuators with appropriate sensory capabilities for soft manipulators requiring greater dexterity and closed-loop control. In this work, we use embedded 3D printing to produce soft robotic fingers with discrete actuation modes and integrated ionogel soft sensors that provide proprioceptive and tactile sensing corresponding to each degree of freedom. With new readout electronics that streamline the measurement of sensor resistance, we evaluate the fingers' sensory feedback through free and blocked displacement experiments. We integrate three of our sensorized fingers together to create a soft manipulator with different grasping poses. Finally, we showcase the importance of the fingers' discrete actuation modes and integrated sensors via a closed-loop grasping study. Our methods demonstrate an enabling manufacturing platform that can be adapted to create other soft multi-DOF manipulators requiring somatosensory feedback for a variety of closed-loop and machine learning-based control algorithms.
Date issued
2019-05
URI
https://hdl.handle.net/1721.1/124372
Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Journal
2nd IEEE International Conference on Soft Robotics (RoboSoft)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Truby, Ryan L. et al. "Soft robotic fingers with embedded ionogel sensors and discrete actuation modes for somatosensitive manipulation." 2nd IEEE International Conference on Soft Robotics (RoboSoft), April 2019, Seoul, Korea (South), IEEE, May 2019 © 2019 IEEE
Version: Author's final manuscript
ISBN
978-1-5386-9260-8

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