| dc.contributor.author | Ai, Han-Jun | |
| dc.contributor.author | Kim, Seoung-Tae | |
| dc.contributor.author | Liu, Cecilia | |
| dc.contributor.author | Buchwald, Stephen L | |
| dc.date.accessioned | 2026-03-12T20:42:48Z | |
| dc.date.available | 2026-03-12T20:42:48Z | |
| dc.date.issued | 2024-09-16 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/165102 | |
| dc.description.abstract | We report a mild method for the copper-catalyzed amination of aryl chlorides. Key to the success of the method was the use of highly sterically encumbered <i>N</i><sup>1</sup>,<i>N</i><sup>2</sup>-diaryl diamine ligands which resist catalyst deactivation, allowing reactions to proceed at significantly lower temperatures and with a broader scope than current protocols. A sequence of highly chemoselective C-N and C-O cross-coupling reactions were demonstrated, and mechanistic studies indicate that oxidative addition of the Cu catalyst to the aryl chlorides is rate-limiting. We anticipate that the design principles disclosed herein will help motivate further advances in Cu-catalyzed transformations of aryl chlorides. | en_US |
| dc.language.iso | en | |
| dc.publisher | American Chemical Society | en_US |
| dc.relation.isversionof | 10.1021/jacs.4c10237 | en_US |
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
| dc.source | PMC | en_US |
| dc.title | Copper-Catalyzed Amination of Aryl Chlorides under Mild Reaction Conditions | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Copper-Catalyzed Amination of Aryl Chlorides under Mild Reaction Conditions. Han-Jun Ai, Seoung-Tae Kim, Cecilia Liu, and Stephen L. Buchwald. Journal of the American Chemical Society 2024 146 (38), 25949-25955. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Chemistry | en_US |
| dc.relation.journal | Journal of the American Chemical Society | en_US |
| dc.eprint.version | Author's final manuscript | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dc.date.updated | 2026-03-12T20:31:06Z | |
| dspace.orderedauthors | Ai, H-J; Kim, S-T; Liu, C; Buchwald, SL | en_US |
| dspace.date.submission | 2026-03-12T20:31:07Z | |
| mit.journal.volume | 146 | en_US |
| mit.journal.issue | 38 | en_US |
| mit.license | PUBLISHER_POLICY | |
| mit.metadata.status | Authority Work and Publication Information Needed | en_US |