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dc.contributor.authorAi, Han-Jun
dc.contributor.authorKim, Seoung-Tae
dc.contributor.authorLiu, Cecilia
dc.contributor.authorBuchwald, Stephen L
dc.date.accessioned2026-03-12T20:42:48Z
dc.date.available2026-03-12T20:42:48Z
dc.date.issued2024-09-16
dc.identifier.urihttps://hdl.handle.net/1721.1/165102
dc.description.abstractWe report a mild method for the copper-catalyzed amination of aryl chlorides. Key to the success of the method was the use of highly sterically encumbered <i>N</i><sup>1</sup>,<i>N</i><sup>2</sup>-diaryl diamine ligands which resist catalyst deactivation, allowing reactions to proceed at significantly lower temperatures and with a broader scope than current protocols. A sequence of highly chemoselective C-N and C-O cross-coupling reactions were demonstrated, and mechanistic studies indicate that oxidative addition of the Cu catalyst to the aryl chlorides is rate-limiting. We anticipate that the design principles disclosed herein will help motivate further advances in Cu-catalyzed transformations of aryl chlorides.en_US
dc.language.isoen
dc.publisherAmerican Chemical Societyen_US
dc.relation.isversionof10.1021/jacs.4c10237en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourcePMCen_US
dc.titleCopper-Catalyzed Amination of Aryl Chlorides under Mild Reaction Conditionsen_US
dc.typeArticleen_US
dc.identifier.citationCopper-Catalyzed Amination of Aryl Chlorides under Mild Reaction Conditions. Han-Jun Ai, Seoung-Tae Kim, Cecilia Liu, and Stephen L. Buchwald. Journal of the American Chemical Society 2024 146 (38), 25949-25955.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Chemistryen_US
dc.relation.journalJournal of the American Chemical Societyen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2026-03-12T20:31:06Z
dspace.orderedauthorsAi, H-J; Kim, S-T; Liu, C; Buchwald, SLen_US
dspace.date.submission2026-03-12T20:31:07Z
mit.journal.volume146en_US
mit.journal.issue38en_US
mit.licensePUBLISHER_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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