Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs
Author(s)
Gomez, Leonardo; Hashemi, Pouya; Hoyt, Judy L.
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Hole mobility and velocity are extracted from scaled strained-Si[subscript 0.4]5Ge[subscript 0.55]channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained- Si[subscript 0.4]5Ge[subscript 0.55]channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of (110) uniaxial compressive strain to Si[subscript 0.4]5Ge[subscript 0.55] can result in a more substantial increase in velocity relative to relaxed Si.
Date issued
2009-10Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer ScienceJournal
IEEE Transactions on Electron Devices
Publisher
Institute of Electrical and Electronics Engineers
Citation
Gomez, L., P. Hashemi, and J.L. Hoyt. “Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs.” Electron Devices, IEEE Transactions on 56.11 (2009): 2644-2651. © 2009 Institute of Electrical and Electronics Engineers
Version: Final published version
Other identifiers
INSPEC Accession Number: 10929303
ISSN
0018-9383
Keywords
uniaxial stress, silicon germanium, p-MOSFET, hole velocity, hole mobility