| dc.contributor.author |
Kim, Byungsub |
|
| dc.contributor.author |
Dickson, Timothy O. |
|
| dc.contributor.author |
Liu, Yong |
|
| dc.contributor.author |
Bulzacchelli, John F. |
|
| dc.contributor.author |
Friedman, Daniel J. |
|
| dc.date.accessioned |
2010-11-05T18:54:39Z |
|
| dc.date.available |
2010-11-05T18:54:39Z |
|
| dc.date.issued |
2009-05 |
|
| dc.date.submitted |
2009-02 |
|
| dc.identifier.isbn |
978-1-4244-3458-9 |
|
| dc.identifier.other |
INSPEC Accession Number: 10727922 |
|
| dc.identifier.uri |
http://hdl.handle.net/1721.1/59837 |
|
| dc.description.abstract |
The design of compact low-power I/O transceivers continues to be a challenge for both chip-to-chip and backplane applications. The introduction of dense fine-pitch silicon packaging technologies, that in principle are capable of supporting tens of thousands of high-data-rate I/O for local chip-to-chip interconnect, will make I/O area and power requirements even more stringent.This paper describes an alternative low-power compact I/O transceiver with RX equalization that achieves the required multi-bit postcursor cancellation without a high tap-count DFE. While this work targets data transmission over Si carrier links at rates up to 10Gb/s, it is also relevant to backplane channels. |
en_US |
| dc.language.iso |
en_US |
|
| dc.publisher |
Institute of Electrical and Electronics Engineers |
en_US |
| dc.relation.isversionof |
http://dx.doi.org/10.1109/ISSCC.2009.4977368 |
en_US |
| dc.rights |
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. |
en_US |
| dc.source |
IEEE |
en_US |
| dc.title |
A 10Gb/s compact low-power serial I/O with DFE-IIR equalization in 65nm CMOS |
en_US |
| dc.type |
Article |
en_US |
| dc.identifier.citation |
Yong Liu et al. “A 10Gb/s compact low-power serial I/O with DFE-IIR equalization in 65nm CMOS.” Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International. 2009. 182-183,183a. © 2009 Institute of Electrical and Electronics Engineers. |
en_US |
| dc.contributor.department |
Massachusetts Institute of Technology. Research Laboratory of Electronics |
en_US |
| dc.contributor.approver |
Kim, Byungsub |
|
| dc.contributor.mitauthor |
Kim, Byungsub |
|
| dc.relation.journal |
IEEE International Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009 |
en_US |
| dc.identifier.mitlicense |
PUBLISHER_POLICY |
en_US |
| dc.eprint.version |
Final published version |
en_US |
| dc.type.uri |
http://purl.org/eprint/type/JournalArticle |
en_US |
| eprint.status |
http://purl.org/eprint/status/PeerReviewed |
en_US |
| dspace.orderedauthors |
Yong Liu; Byungsub Kim; Dickson, T.O.; Bulzacchelli, J.F.; Friedman, D.J. |
en |