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dc.contributor.authorTaff, Brian M.
dc.contributor.authorDesai, Salil P.
dc.contributor.authorVoldman, Joel
dc.date.accessioned2011-01-07T20:33:30Z
dc.date.available2011-01-07T20:33:30Z
dc.date.issued2009-02
dc.date.submitted2008-12
dc.identifier.issn1077-3118
dc.identifier.issn0003-6951
dc.identifier.urihttp://hdl.handle.net/1721.1/60409
dc.description.abstractWe present a platform for parallelized manipulations of individual polarizable micron-scale particles (i.e., microparticles) that combines negative dielectrophoretic forcing with the passive capture of hydrodynamic weir-based trapping. Our work enables manipulations using ejection- and/or exclusion-based methods. In ejection operations, we unload targeted weirs by displacing microparticles from their capture faces via electrode activation. In exclusion-based operations, we prevent weir loading by activating selected on-chip electrodes before introducing microparticles into the system. Our work describes the device’s passive loading dynamics and demonstrates enhanced functionalities by forming a variety of particle patterns.en_US
dc.description.sponsorshipNational Institutes of Health (U.S.) (Contract No. RR19652)en_US
dc.description.sponsorshipSingapore-MIT Allianceen_US
dc.language.isoen_US
dc.publisherAmerican Institute of Physicsen_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.3085955en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceMIT web domainen_US
dc.titleElectroactive hydrodynamic weirs for microparticle manipulation and patterningen_US
dc.typeArticleen_US
dc.identifier.citationTaff, Brian M., Salil P. Desai, and Joel Voldman. “Electroactive hydrodynamic weirs for microparticle manipulation and patterning.” Applied Physics Letters 94.8 (2009): 084102-3. © 2009 American Institute of Physics.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverVoldman, Joel
dc.contributor.mitauthorVoldman, Joel
dc.contributor.mitauthorTaff, Brian M.
dc.contributor.mitauthorDesai, Salil P.
dc.relation.journalApplied Physical Lettersen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsTaff, Brian M.; Desai, Salil P.; Voldman, Joelen
dc.identifier.orcidhttps://orcid.org/0000-0001-8898-2296
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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