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dc.contributor.authorKolluri, Kedarnath
dc.contributor.authorDemkowicz, Michael J.
dc.date.accessioned2016-03-29T18:35:08Z
dc.date.available2016-03-29T18:35:08Z
dc.date.issued2011-12
dc.identifier.issn13596454en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/101910
dc.description.abstractUsing atomistic modeling, we show that restructuring of the network of interconnected ligaments causes coarsening in a model of nanoporous gold. The restructuring arises from the collapse of some ligaments onto neighboring ones and is enabled by localized plasticity at ligaments and nodes. This mechanism may explain the occurrence of enclosed voids and reduction in volume in nanoporous metals during their synthesis. An expression is developed for the critical ligament radius below which coarsening by network restructuring may occur spontaneously, setting a lower limit to the ligament dimensions of nanofoams.
dc.language.isoen_US
dc.relation.isversionofhttp://dx.doi.org/10.1016/j.actamat.2011.08.037en_US
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivs Licenseen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/en_US
dc.sourceProf. Demkowicz via Angie Locknaren_US
dc.titleCoarsening by network restructuring in model nanoporous golden_US
dc.typeArticleen_US
dc.identifier.citationKolluri, Kedarnath, and Michael J. Demkowicz. “Coarsening by Network Restructuring in Model Nanoporous Gold.” Acta Materialia 59, no. 20 (December 2011): 7645–7653.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.contributor.approverDemkowicz, Michael J.en_US
dc.contributor.mitauthorKolluri, Kedarnath
dc.contributor.mitauthorDemkowicz, Michael J.
dc.relation.journalActa Materialiaen_US
dc.eprint.versionOriginal manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsKolluri, Kedarnath; Demkowicz, Michael J.en_US
dc.identifier.orcidhttps://orcid.org/0000-0003-3949-0441
mit.licensePUBLISHER_CCen_US


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