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Close-Packed Silicon Microelectrodes for Scalable Spatially Oversampled Neural Recording

Author(s)
Scholvin, Jorg; Kinney, Justin; Bernstein, Jacob G.; Moore-Kochlacs, Caroline; Kopell, Nancy; Fonstad, Clifton G.; Boyden, Edward Stuart; ... Show more Show less
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Abstract
Objective: Neural recording electrodes are important tools for understanding neural codes and brain dynamics. Neural electrodes that are closely packed, such as in tetrodes, enable spatial oversampling of neural activity, which facilitates data analysis. Here we present the design and implementation of close-packed silicon microelectrodes to enable spatially oversampled recording of neural activity in a scalable fashion. Methods: Our probes are fabricated in a hybrid lithography process, resulting in a dense array of recording sites connected to submicron dimension wiring. Results: We demonstrate an implementation of a probe comprising 1000 electrode pads, each 9 × 9 μm, at a pitch of 11 μm. We introduce design automation and packaging methods that allow us to readily create a large variety of different designs. Significance: We perform neural recordings with such probes in the live mammalian brain that illustrate the spatial oversampling potential of closely packed electrode sites.
Date issued
2015-12
URI
http://hdl.handle.net/1721.1/103554
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Media Laboratory; McGovern Institute for Brain Research at MIT; McGovern Institute for Brain Research at MIT
Journal
IEEE Transactions on Biomedical Engineering
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Scholvin, Jorg, Justin P. Kinney, Jacob G. Bernstein, Caroline Moore-Kochlacs, Nancy Kopell, Clifton G. Fonstad, and Edward S. Boyden. “Close-Packed Silicon Microelectrodes for Scalable Spatially Oversampled Neural Recording.” IEEE Trans. Biomed. Eng. 63, no. 1 (January 2016): 120–130.
Version: Author's final manuscript
Other identifiers
INSPEC Accession Number: 15669071
ISSN
0018-9294
1558-2531

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