Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon
Author(s)
Vayrette, Renaud; Raskin, Jean-Pierre; Pardoen, Thomas; Galceran, Montserrat; Godet, Stéphane; Noels, Ludovic; Mulay, Shantanu S.; Becker, Gauthier; ... Show more Show less
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Micro-electro-mechanical systems (MEMS) made of polycrystalline silicon are widely used in several engineering fields. The fracture properties of polycrystalline silicon directly affect their reliability. The effect of the orientation of grains on the fracture behaviour of polycrystalline silicon is investigated out of the several factors. This is achieved, firstly, by identifying the statistical variation of the fracture strength and critical strain energy release rate, at the nanoscopic scale, over a thin freestanding polycrystalline silicon film having mesoscopic scale dimensions. The fracture stress and strain at the mesoscopic level are found to be closely matching with uniaxial tension experimental results. Secondly, the polycrystalline silicon film is considered at the continuum MEMS scale, and its fracture behaviour is studied by incorporating the nanoscopic scale effect of grain orientation. The entire modelling and simulation of the thin film is achieved by combining the discontinuous Galerkin method and extrinsic cohesive law describing the fracture process.
Date issued
2014-10Department
Massachusetts Institute of Technology. Department of Aeronautics and AstronauticsJournal
Computational Mechanics
Publisher
Springer-Verlag
Citation
Mulay, Shantanu S., Gauthier Becker, Renaud Vayrette, et al. "Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon." Computational Mechanics, vol. 55, no. 1, October 2014, pp. 73-91.
Version: Author's final manuscript
ISSN
0178-7675
1432-0924