Conformal single-layer encapsulation of PEDOT at low substrate temperature
Author(s)Chen, Nan; Wang, Xiaoxue; Gleason, Karen K
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In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation.
DepartmentMassachusetts Institute of Technology. Department of Chemical Engineering
Applied Surface Science
Chen, Nan, Xiaoxue Wang, and Karen K. Gleason. “Conformal Single-Layer Encapsulation of PEDOT at Low Substrate Temperature.” Applied Surface Science 323 (December 2014): 2-6.
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