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Conformal single-layer encapsulation of PEDOT at low substrate temperature

Author(s)
Chen, Nan; Wang, Xiaoxue; Gleason, Karen K
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Abstract
In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation.
Date issued
2014-06
URI
http://hdl.handle.net/1721.1/106566
Department
Massachusetts Institute of Technology. Department of Chemical Engineering
Journal
Applied Surface Science
Publisher
Elsevier
Citation
Chen, Nan, Xiaoxue Wang, and Karen K. Gleason. “Conformal Single-Layer Encapsulation of PEDOT at Low Substrate Temperature.” Applied Surface Science 323 (December 2014): 2-6.
Version: Author's final manuscript
ISSN
01694332
1873-5584

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