Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing
Author(s)Oliveira, M. J.; Peixoto, A. C.; Correia, J. H.; Goncalves, S. B; Silva, A. F.
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\This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D MEA fabrication, without unnecessary additional steps of etching post-processing. The optimized fabrication process was successfully demonstrated with a 3D neural probe array comprising 36 individually addressable electrodes.
The International Journal of Advanced Manufacturing Technology
Goncalves, S. B. et al. “Out-of-Plane Neural Microelectrode Arrays Fabrication Using Conventional Blade Dicing.” The International Journal of Advanced Manufacturing Technology 85.1–4 (2016): 431–442.
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