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dc.contributor.authorZhang, Tiejun
dc.contributor.authorWang, Evelyn
dc.contributor.authorZhu, Yangying
dc.contributor.authorAntao, Dion Savio
dc.contributor.authorLu, Zhengmao
dc.contributor.authorSomasundaram, Sivanand
dc.date.accessioned2017-04-11T12:51:03Z
dc.date.available2017-04-11T12:51:03Z
dc.date.issued2016-01
dc.date.submitted2016-01
dc.identifier.issn0743-7463
dc.identifier.issn1520-5827
dc.identifier.urihttp://hdl.handle.net/1721.1/108034
dc.description.abstractThin-film evaporation in wick structures for cooling high-performance electronic devices is attractive because it harnesses the latent heat of vaporization and does not require external pumping. However, optimizing the wick structures to increase the dry-out heat flux is challenging due to the complexities in modeling the liquid–vapor interface and the flow through the wick structures. In this work, we developed a model for thin-film evaporation from micropillar array wick structures and validated the model with experiments. The model numerically simulates liquid velocity, pressure, and meniscus curvature along the wicking direction by conservation of mass, momentum, and energy based on a finite volume approach. Specifically, the three-dimensional meniscus shape, which varies along the wicking direction with the local liquid pressure, is accurately captured by a force balance using the Young–Laplace equation. The dry-out condition is determined when the minimum contact angle on the pillar surface reaches the receding contact angle as the applied heat flux increases. With this model, we predict the dry-out heat flux on various micropillar structure geometries (diameter, pitch, and height) in the length scale range of 1–100 μm and discuss the optimal geometries to maximize the dry-out heat flux. We also performed detailed experiments to validate the model predictions, which show good agreement. This work provides insights into the role of surface structures in thin-film evaporation and offers important design guidelines for enhanced thermal management of high-performance electronic devices.en_US
dc.description.sponsorshipUnited States. Office of Naval Research (N00014-15-1-2483)en_US
dc.language.isoen_US
dc.publisherAmerican Chemical Society (ACS)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1021/acs.langmuir.5b04502en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceProf. Evelyn Wangen_US
dc.titlePrediction and Characterization of Dry-out Heat Flux in Micropillar Wick Structuresen_US
dc.typeArticleen_US
dc.identifier.citationZhu, Yangying, Antao, Dion S., Lu, Zhengmao, Somasundaram, Sivanand, Zhang, Tiejun, and Wang, Evelyn N. “Prediction and Characterization of Dry-Out Heat Flux in Micropillar Wick Structures.” Langmuir 32, no. 7 (February 23, 2016): 1920–1927. Copyright © 2016 American Chemical Societyen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.departmentSingapore-MIT Alliance in Research and Technology (SMART)en_US
dc.contributor.approverWang, Evelyn N.en_US
dc.contributor.mitauthorWang, Evelyn
dc.contributor.mitauthorZhu, Yangying
dc.contributor.mitauthorAntao, Dion Savio
dc.contributor.mitauthorLu, Zhengmao
dc.contributor.mitauthorSomasundaram, Sivanand
dc.relation.journalLangmuiren_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsZhu, Yangying; Antao, Dion S.; Lu, Zhengmao; Somasundaram, Sivanand; Zhang, Tiejun; Wang, Evelyn N.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0001-7045-1200
dc.identifier.orcidhttps://orcid.org/0000-0001-9185-3161
dc.identifier.orcidhttps://orcid.org/0000-0003-4165-4732
dc.identifier.orcidhttps://orcid.org/0000-0002-5938-717X
mit.licensePUBLISHER_POLICYen_US


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