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dc.contributor.authorWang, Zhang-Jie
dc.contributor.authorLi, Qing-Jie
dc.contributor.authorCui, Yi-Nan
dc.contributor.authorLiu, Zhan-Li
dc.contributor.authorMa, Evan
dc.contributor.authorZhuang, Zhuo
dc.contributor.authorShan, Zhi-Wei
dc.contributor.authorSuresh, Subra
dc.contributor.authorLi, Ju
dc.contributor.authorDao, Ming
dc.contributor.authorSun, Jun, 1975-
dc.date.accessioned2017-05-04T17:41:37Z
dc.date.available2017-05-04T17:41:37Z
dc.date.issued2015-11
dc.date.submitted2015-08
dc.identifier.issn0027-8424
dc.identifier.issn1091-6490
dc.identifier.urihttp://hdl.handle.net/1721.1/108669
dc.description.abstractWhen microscopic and macroscopic specimens of metals are subjected to cyclic loading, the creation, interaction, and accumulation of defects lead to damage, cracking, and failure. Here we demonstrate that when aluminum single crystals of submicrometer dimensions are subjected to low-amplitude cyclic deformation at room temperature, the density of preexisting dislocation lines and loops can be dramatically reduced with virtually no change of the overall sample geometry and essentially no permanent plastic strain. This “cyclic healing” of the metal crystal leads to significant strengthening through dramatic reductions in dislocation density, in distinct contrast to conventional cyclic strain hardening mechanisms arising from increases in dislocation density and interactions among defects in microcrystalline and macrocrystalline metals and alloys. Our real-time, in situ transmission electron microscopy observations of tensile tests reveal that pinned dislocation lines undergo shakedown during cyclic straining, with the extent of dislocation unpinning dependent on the amplitude, sequence, and number of strain cycles. Those unpinned mobile dislocations moving close enough to the free surface of the thin specimens as a result of such repeated straining are then further attracted to the surface by image forces that facilitate their egress from the crystal. These results point to a versatile pathway for controlled mechanical annealing and defect engineering in submicrometer-sized metal crystals, thereby obviating the need for thermal annealing or significant plastic deformation that could cause change in shape and/or dimensions of the specimen.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant DMR-1120901)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (DMR-1410636)en_US
dc.description.sponsorshipSingapore-MIT Allianceen_US
dc.language.isoen_US
dc.publisherNational Academy of Sciences (U.S.)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1073/pnas.1518200112en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceNational Academy of Sciences (U.S.)en_US
dc.titleCyclic deformation leads to defect healing and strengthening of small-volume metal crystalsen_US
dc.typeArticleen_US
dc.identifier.citationWang, Zhang-Jie, Qing-Jie Li, Yi-Nan Cui, Zhan-Li Liu, Evan Ma, Ju Li, Jun Sun, et al. “Cyclic Deformation Leads to Defect Healing and Strengthening of Small-Volume Metal Crystals.” Proc Natl Acad Sci USA 112, no. 44 (October 19, 2015): 13502–13507. © 2015 National Academy of Sciencesen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Nuclear Science and Engineeringen_US
dc.contributor.mitauthorLi, Ju
dc.contributor.mitauthorDao, Ming
dc.relation.journalProceedings of the National Academy of Sciences of the United States of Americaen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsWang, Zhang-Jie; Li, Qing-Jie; Cui, Yi-Nan; Liu, Zhan-Li; Ma, Evan; Li, Ju; Sun, Jun; Zhuang, Zhuo; Dao, Ming; Shan, Zhi-Wei; Suresh, Subraen_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-7841-8058
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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