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dc.contributor.authorUeland, Stian Melhus
dc.contributor.authorSchuh, Christopher A
dc.date.accessioned2017-05-30T14:13:56Z
dc.date.available2017-05-30T14:13:56Z
dc.date.issued2014-02
dc.date.submitted2014-02
dc.identifier.urihttp://hdl.handle.net/1721.1/109408
dc.description.abstractSuperelasticity in Cu–Zn–Al shape memory alloy microwires is studied as a function of surface roughness. Wires with a rough surface finish dissipate more than twice as much energy per unit volume during a superelastic cycle than do electropolished wires with smooth surfaces. We attribute the increased damping in wires with large surface roughness to the increased density of surface obstacles where frictional energy is dissipated as heat during martensitic phase transformation.en_US
dc.description.sponsorshipUnited States. Army Research Office. Institute for Soldier Nanotechnologiesen_US
dc.language.isoen_US
dc.publisherElsevieren_US
dc.relation.isversionofhttp://dx.doi.org/10.1016/j.scriptamat.2014.02.017en_US
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivs Licenseen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/en_US
dc.sourceProf. Schuh via Angie Locknaren_US
dc.titleSurface Roughness-Controlled Superelastic Hysteresis in Shape Memory Microwiresen_US
dc.typeArticleen_US
dc.identifier.citationUeland, Stian M. and Christopher A. Schuh. "Surface Roughness-Controlled Superelastic Hysteresis in Shape Memory Microwires." Scripta Materialia 82 (2014): 1-4.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.approverSchuh, Christopheren_US
dc.contributor.mitauthorUeland, Stian Melhus
dc.contributor.mitauthorSchuh, Christopher A
dc.relation.journalScripta Materialiaen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsUeland, Stian M. ; Schuh, Christopher A.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0001-9856-2682
mit.licensePUBLISHER_CCen_US
mit.metadata.statusComplete


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