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dc.contributor.authorDing, Ming-Shuai
dc.contributor.authorTian, Lin
dc.contributor.authorHan, Wei-Zhong
dc.contributor.authorMa, Evan
dc.contributor.authorShan, Zhi-Wei
dc.contributor.authorLi, Ju
dc.date.accessioned2017-06-07T17:45:47Z
dc.date.available2017-06-07T17:45:47Z
dc.date.issued2016-11
dc.date.submitted2016-08
dc.identifier.issn0031-9007
dc.identifier.issn1079-7114
dc.identifier.urihttp://hdl.handle.net/1721.1/109713
dc.description.abstractHelium bubbles are one of the typical radiation microstructures in metals and alloys, significantly influencing their deformation behavior. However, the dynamic evolution of helium bubbles under straining is less explored so far. Here, by using in situ micromechanical testing inside a transmission electron microscope, we discover that the helium bubble not only can coalesce with adjacent bubbles, but also can split into several nanoscale bubbles under tension. Alignment of the splittings along a slip line can create a bubble-free channel, which appears softer, promotes shear localization, and accelerates the failure in the shearing-off mode. Detailed analyses unveil that the unexpected bubble fragmentation is mediated by the combination of dislocation cutting and internal surface diffusion, which is an alternative microdamage mechanism of helium irradiated copper besides the bubble coalescence.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (DMR-1410636)en_US
dc.publisherAmerican Physical Societyen_US
dc.relation.isversionofhttp://dx.doi.org/10.1103/PhysRevLett.117.215501en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceAmerican Physical Societyen_US
dc.titleNanobubble Fragmentation and Bubble-Free-Channel Shear Localization in Helium-Irradiated Submicron-Sized Copperen_US
dc.typeArticleen_US
dc.identifier.citationDing, Ming-Shuai; Tian, Lin; Han, Wei-Zhong; Li, Ju; Ma, Evan and Shan, Zhi-Wei. "Nanobubble Fragmentation and Bubble-Free-Channel Shear Localization in Helium-Irradiated Submicron-Sized Copper." Physical Review Letters 117, 215501: 1-5 © 2016 American Physical Societyen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Nuclear Science and Engineeringen_US
dc.contributor.mitauthorLi, Ju
dc.relation.journalPhysical Review Lettersen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2016-11-16T23:00:03Z
dc.language.rfc3066en
dc.rights.holderAmerican Physical Society
dspace.orderedauthorsDing, Ming-Shuai; Tian, Lin; Han, Wei-Zhong; Li, Ju; Ma, Evan; Shan, Zhi-Weien_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-7841-8058
mit.licensePUBLISHER_POLICYen_US


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