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dc.contributor.authorTian, Zhiting
dc.contributor.authorMarconnet, Amy
dc.contributor.authorChen, Gang
dc.date.accessioned2017-06-13T17:22:32Z
dc.date.available2017-06-13T17:22:32Z
dc.date.issued2015-05
dc.date.submitted2015-02
dc.identifier.issn0003-6951
dc.identifier.issn1077-3118
dc.identifier.urihttp://hdl.handle.net/1721.1/109821
dc.description.abstractThe thermal conductance across solid-liquid interfaces is of interest for many applications. Using time-domain thermoreflectance, we measure the thermal conductance across self-assembled monolayers, grown on Au, to ethanol. We systematically study the effect of different functional groups and the alkyl chain length on the thermal conductance. The results show that adding this extra molecular layer can enhance the thermal transport across the solid-liquid interface. While the enhancement is up to 5 times from hexanedithiol, the enhancement from hexanethiol, undecanethiol, and hexadecanethiol is approximately a factor of 2.en_US
dc.description.sponsorshipUnited States. Air Force. Office of Scientific Research (Grant No. FA9550-11-1-0174)en_US
dc.description.sponsorshipUnited States. Department of Energy (Office of Science, Office of Basic Energy Sciences, award No. DE-SC0001299)en_US
dc.description.sponsorshipUnited States. Department of Energy (Office of Science, Office of Basic Energy Sciences, award No. DE-FG02-09ER46577)en_US
dc.language.isoen_US
dc.publisherAmerican Institute of Physics (AIP)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.4921758en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceProf. Chen via Angie Locknaren_US
dc.titleEnhancing solid-liquid interface thermal transport using self-assembled monolayersen_US
dc.typeArticleen_US
dc.identifier.citationTian, Zhiting, Amy Marconnet, and Gang Chen. “Enhancing Solid-Liquid Interface Thermal Transport Using Self-Assembled Monolayers.” Applied Physics Letters 106, no. 21 (May 25, 2015): 211602.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.approverChen, Gangen_US
dc.contributor.mitauthorChen, Gang
dc.relation.journalApplied Physics Lettersen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsTian, Zhiting; Marconnet, Amy; Chen, Gangen_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-3968-8530
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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