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dc.contributor.authorWang, Bing
dc.contributor.authorWang, Cong
dc.contributor.authorLee, Kwang Hong
dc.contributor.authorBao, Shuyu
dc.contributor.authorLee, Kenneth Eng Kian
dc.contributor.authorTan, Chuan Seng
dc.contributor.authorYoon, Soon Fatt
dc.contributor.authorMichel, Jurgen
dc.contributor.authorFitzgerald, Eugene A
dc.date.accessioned2017-10-10T20:55:30Z
dc.date.available2017-10-10T20:55:30Z
dc.date.issued2016-03
dc.identifier.issn0277-786X
dc.identifier.issn1996-756X
dc.identifier.urihttp://hdl.handle.net/1721.1/111831
dc.description.abstractThe integration of light emitting devices on silicon substrates has attracted intensive research for many years. In contrast to the InGaN light emitting diodes (LEDs) whose epitaxy technology on Si substrates is robust and mature, the epitaxy of other compound semiconductor light emitting materials covering the visible wavelength range on Si is still challenging. We have studied epitaxial growth of red InGaP light emitting materials on engineered Ge-on-Si substrates. Ge-on-Si was grown on 8'' Si substrates in a metal organic chemical vapour deposition (MOCVD) reactor using two- step growth and cycling annealing. Threading dislocation densities (TDDs) were controlled to as low as 10⁶ /cm² by using As-doped Ge initiation. A GaAs buffer layer and lattice-matched InGaP LEDs were grown on the Ge-on-Si sequentially in the same MOCVD process and red LEDs are demonstrated. InGaP multiple-quantum-well LED structures were grown on full 8″ Ge-on-Si substrates and characterized.en_US
dc.publisherSPIEen_US
dc.relation.isversionofhttp://dx.doi.org/10.1117/12.2211562en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceSPIEen_US
dc.titleRed InGaP light-emitting diodes epitaxially grown on engineered Ge-on-Si substratesen_US
dc.typeArticleen_US
dc.identifier.citationWang, Bing et al. “Red InGaP Light-Emitting Diodes Epitaxially Grown on Engineered Ge-on-Si Substrates.” Edited by Heonsu Jeon, Li-Wei Tu, Michael R. Krames, and Martin Strassburg. Proceedings of SPIE, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XX, 9768 (March 2016): 97681J. © SPIEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorFitzgerald, Eugene A
dc.relation.journalProceedings of SPIE--the Society of Photo-Optical Instrumentation Engineersen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2017-10-06T16:21:52Z
dspace.orderedauthorsWang, Bing; Wang, Cong; Lee, Kwang Hong; Bao, Shuyu; Lee, Kenneth Eng Kian; Tan, Chuan Seng; Yoon, Soon Fatt; Fitzgerald, Eugene A.; Michel, Jurgenen_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-1891-1959
mit.licensePUBLISHER_POLICYen_US


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