Estimating object hardness with a GelSight touch sensor
Author(s)
Yuan, Wenzhen; Srinivasan, Mandayam A; Adelson, Edward H
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Hardness sensing is a valuable capability for a robot touch sensor. We describe a novel method of hardness sensing that does not require accurate control of contact conditions. A GelSight sensor is a tactile sensor that provides high resolution tactile images, which enables a robot to infer object properties such as geometry and fine texture, as well as contact force and slip conditions. The sensor is pressed on silicone samples by a human or a robot and we measure the sample hardness only with data from the sensor, without a separate force sensor and without precise knowledge of the contact trajectory. We describe the features that show object hardness. For hemispherical objects, we develop a model to measure the sample hardness, and the estimation error is about 4% in the range of 8 Shore 00 to 45 Shore A. With this technology, a robot is able to more easily infer the hardness of the touched objects, thereby improving its object recognition as well as manipulation strategy.
Date issued
2016-12Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Brain and Cognitive Sciences; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Department of Mechanical Engineering; Massachusetts Institute of Technology. Laboratory for Human and Machine HapticsJournal
2016 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Yuan, Wenzhen et al. “Estimating Object Hardness with a GelSight Touch Sensor.” 2016 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), October 9-14 2016, Daejeon, South Korea, Institute of Electrical and Electronics Engineers (IEEE), December 2016 © 2016 Institute of Electrical and Electronics Engineers (IEEE)
Version: Author's final manuscript
ISBN
978-1-5090-3762-9
ISSN
2153-0866